A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure.

Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production as well as in industrial research.

The mask aligners supplied by SUSS MicroTec are based on proximity lithography.

Features & Benefits

Superior resolution as a result of diffraction-reducing optics

Process stability through the use of microlens optical systems

Available for:

Automated Mask Aligner

· MA300 Gen2

· MA200 Gen3

· MA100/150e Gen2

Semi-Automated Mask Aligner

· MA12

· MA/BA Gen4 Pro series

· MA/BA Gen4 series

· MA/BA6

Manual Mask Aligner

· MJB4